Видео с ютуба Chiplet Interposer

CHIPLETS: Разделяй и властвуй | Будущее процессоров

Advanced Packaging Techniques (Semi 101)

Мир передовой упаковки

Driving Down The Cost of Next-Generation CPUs

Are Chiplets and Interposers Commercially Viable?

AMD ZEN 6 — Next-gen Chiplets & Packaging

Glass Substrates Explained in 60 Seconds

Heterogeneous integration: A system approach to advanced chiplet design

Interposers, Chiplets and...ButterDonuts?

Packaging Part 3 - Silicon Interposer

Intel Leads the Way with Advanced Packaging

How Chiplets will Revolutionize the Electronic Design World

Getting Moore with Less: How Chiplets and Open Interconnect Accelerate Cloud-Optimized AI Silicon

Interposer placement using H01V head

Revolutionary Chiplet Integration - Unleashing The Secrets Of Advanced Packaging Techniques

3D-IC design, analysis and implementation - Cadence Integrity 3D-IC platform

Упаковка Часть 4 - 2.5D и 3D

8 Packaging process technology Can Organic Interposer eat Si Interposer's lunch a Trip with Bing

Organic interposer by 3D X-ray layer by layer

RapidChiplet: How to Explore the Design Space of Inter-Chiplet Interconnects

2.5D ICs or interposer technology

Design methodology for scalable 2.5D/3D heterogenous tiled chiplet systems

Interconnecting Chiplets: A Many-Layered Challenge

[Eng Sub] TSV (Through Silicon Via) - HBM, кремниевый интерпозер, датчик изображения КМОП, MEMS

3D Interconnect Designer Demo